We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Multilayer board.
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Multilayer board Product List and Ranking from 9 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

Multilayer board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. ExPlus Taiwan//Electronic Components and Semiconductors
  2. 村上電子工学 Osaka//Manufacturing and processing contract
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 富山技販 Toyama//Testing, Analysis and Measurement
  5. 5 スクリーンプロセス Kanagawa//others
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Multilayer board Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. [Case Study] Delivery Record of High Multi-Layer Rigid Boards 村上電子工学
  2. Six-layer multi-layer substrate ExPlus
  3. <High Quality> Direct Imaging System スクリーンプロセス
  4. Bandata Industrial Co., Ltd. Business Introduction 邦田工業 本社
  5. 4 Multilayer substrate ExPlus

Multilayer board Product List

1～13 item / All 13 items

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<High Quality> Direct Imaging System

<High Quality> Direct Imaging System

The pad pitch is 0.5mm! It is suitable for fine pattern products.

We would like to introduce our "Direct Imaging System." It is suitable for fine pattern products such as substrates with 0.3mm to 0.65mm pitch BGA and CSP, as well as flip chip mounted substrates. Additionally, it is applicable to products requiring high alignment accuracy. Please feel free to contact us when you need assistance. 【Features】 ■ High-difficulty fine patterns ■ Fine pattern formation ■ Resist formation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[Case Study] Delivery Record of High Multi-Layer Rigid Boards

[Case Study] Delivery Record of High Multi-Layer Rigid Boards

Introducing a case study on the introduction of high-multilayer rigid substrates by Murakami Electronics Co., Ltd.!

Murakami Electronics Co., Ltd. is a manufacturer specializing in the prototyping and mass production of double-sided and multilayer printed circuit boards. We would like to introduce a case study of the "High Multilayer Rigid Board" using FR-5 material. 【Case Study】 ■ High Multilayer Rigid Board 　・0.5mm Pitch BGA 　・0.5mm Pitch Through-hole TH Type PWB (Surface Pad on Via) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Bandata Industrial Co., Ltd. Business Introduction

Bandata Industrial Co., Ltd. Business Introduction

Technology that makes people happy, the potential of circuit boards. Aiming to create trusted people, products, and companies.

Our company is equipped with all the necessary facilities for design, manufacturing, and shipping as a circuit board manufacturer, ensuring high quality and precision. The circuit boards demanded by the times are "small and high-performance," with the mainstream moving towards "multi-layer" (multi-layer boards). By increasing the number of layers, we achieve space-saving, faster signal transmission, and reduced noise. Currently, Kunita can accommodate types ranging from 2 to 6 layers, contributing to the field of multi-layer boards used in high-power computers. We provide detailed services that leverage the advantages of being an independent company, not participating in large manufacturers. Please feel free to consult us with your requests. 【Sales Items】 ■ Printed circuit boards (single-sided, double-sided) ■ Various through-hole boards ■ Flexible boards ■ Flash boards ■ Aluminum base boards ■ Multi-layer boards, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts

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Large high multi-layer, large, long-length substrate

Large high multi-layer, large, long-length substrate

Motherboards for information and communication devices, capable of producing super-large sizes for BTB applications!

We can manufacture large circuit boards for motherboard, backboard, and server applications. We support up to 24 layers with dimensions of 750mm × 1,100mm. 【Features】 ■ Maximum product size: 1050 × 570mm ■ Capable of core processing with copper thickness of 300–400μm ■ Maximum total thickness: t5.0–6.0mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Multilayer substrate

Multilayer substrate

The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Processing Contract
  • Circuit board design and manufacturing

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High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

High-end EMS "Advanced M&EMS" *Exhibited at Nepcon

Presentation of Case Studies for Problem Solving: One-stop support from design to maintenance! We respond to various needs such as entering new markets and multilayering of circuit boards.

Our company offers a design and production outsourcing service called 'Advanced M&EMS' for information and communication equipment, medical devices, industrial equipment, and measuring instruments. We can support everything from design to procurement, implementation, prototyping, equipment assembly, and maintenance. We can meet various needs, including entry into the medical device market, small-batch production of diverse products, and miniaturization of multilayer ceramic capacitors. ★ We will be exhibiting at the "36th NEPCON Japan" held from January 19, 2022! 【Overview of the "36th NEPCON Japan"】 Dates: January 19 (Wednesday) to 21 (Friday), 2022 Venue: Tokyo Big Sight Booth Number: East Hall 1, 9-22 We will showcase many examples of our technology and applications that contribute to solving manufacturing challenges. Please feel free to visit our booth. *We are currently offering a collection of case studies on problem-solving. For more details, please check the "PDF Download."

  • others

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[IH Soldering Case] Large Heat Capacity Substrate

[IH Soldering Case] Large Heat Capacity Substrate

A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.

We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

  • Printed Circuit Board

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole designs as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process, including: - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments and more. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial manufacturing costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our website.

  • Printed Circuit Board

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Six-layer multi-layer substrate

Six-layer multi-layer substrate

The functions of electronic devices are becoming increasingly complex and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Circuit board design and manufacturing
  • EMS
  • Processing Contract

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Multilayer substrate

Multilayer substrate

We have a manufacturing record of up to 22 layers, and we can accommodate various specifications for board thickness and copper foil thickness!

We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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